林佳樺老師
(1) 3D Packaging & Heterogeneous Integration
(2) High-Reliability Packaging Materials and Thermal Stress Management
(3) Molecular Electronics and Intelligent Sensing Interfaces for Smart Packaging
- Combining molecular chemistry with device physics, this research develops metal-organic framework (MOF) based ion-gated transistors (IGFETs).
- By manipulating the thin-film states of functional molecules like Mn-TCPP, we achieve high-sensitivity monitoring of internal stress, thermal history, and chemical signals (e.g., H₂O₂).
- We establishes engineering pathways for MOF-based electronics, providing a high-performance, self-diagnostic sensing platform for future smart packaging and biomedical applications.