研究方向：Wild-Bandgap (GaN and β-Ga2O3) Power Devices, Semiconductor-Based Bio-Chip Development, Device Reliability Evaluation and Failure-Mechanism Analysis
研究方向：New materials of wire-bonding/wedge-bonding technology in IC and optoelectronics packaging、Thermal & humidity induced degradation in μLEDs system (GaN device) as well as its life prediction