We have established a Semiconductor Microprocessing Program.
This program consists of three courses.
First, Semiconductor Manufacturing Technology, covering the complete process from wafer fabrication to device molding, cultivating students' professional knowledge in the field of semiconductor manufacturing.
Second, Semiconductor Packaging, a key technology for protecting, interconnecting, and testing chips. This course introduces the basic principles, processes, material applications, and the latest advanced packaging technologies.
Third, Semiconductor Process Integration Practice, designed to cultivate students' theoretical knowledge and practical skills in semiconductor process integration, covering the complete workflow from materials analysis to device characterization and testing.